WIRE BONDING IN MICROELECTRONICS, 3/E

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Publisher ‏ : ‎ McGraw Hill; 3rd edition (16 Mar. 2010)
Language ‏ : ‎ English
Hardcover ‏ : ‎ 446 pages
ISBN-10 ‏ : ‎ 0071476237
ISBN-13 ‏ : ‎ 978-0071476232
Dimensions ‏ : ‎ 15.49 x 3.3 x 23.11 cm

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